HU – Page 3 – TechConnect Briefs

Algorithmic and Modeling Aspects in the Electro-thermal Simulation of Thermally Operated Microsystems

Rencz M., Székely V., Poppe A., Courtois B., Micred, HU

A new algorithm has been developed for the layout based electro-thermal simulation of integrated circuits and MEMS, using simultaneous iteration. The general advantage of this method over simulator coupling is that, in contrast with the [...]

A Method for Thermal Model Generation of MEMS Packages

Rencz M., Székely V., Kohári Zs., Courtois B., Micred Ltd., HU

MEMS applications are frequently thermally operated, so knowing the thermal characteristics of their packages is very important. This paper presents a method for the generation of reduced order dynamic thermal models, either from simulated or [...]

SUNRED: A Field Solver and Compact Model Generator Tool Based on Successive Node Reduction

Székely V., Páhi A., Rosenthal M., Rencz M., Techical Unviersity of Budapest, HU

The paper presents the new features of the SUNRED field solver program: the visualization of the structures in the 3D version, and the new dynamic simulation methods. Comparisons with other field solvers demonstrate the superior [...]

Thermal Simulation Tools for Microsystem Elements

Székely V., Rencz M., Páhi A., Poppe A., Hajder Sz., Technical University of Budapest, HU

Two different field solver tools have been developed in order ro facilitate fast thermal and electro-static simulation of microsystem elements. The pSTHERMANAL program is capable for the fast steadystate and dynamic simulation of suspended multilayered [...]