CH – Page 16 – TechConnect Briefs

Simulations of a New CMOS Compatible Method to Enhance the Breakdown Voltage of Highly-Doped Shallow PN Junctions

Pauchard A., Besse P.A., Popovic R.S., EPFL, CH

Avalanche breakdown often limits the working range of planar junction diodes in electronic circuits and in sensors. We present two-dimensional device simulation results (using MEDICI) of a novel CMOS compatible structure. It combines a floating [...]

Dispersive Media in FDTD-Comparison of Recursive Convolution and Auxiliary Differential Equation Methods

Körner T.O., Fichtner W., ETH-EPFL, CH

A new, efficient algorithm for modelling dispersive media in Finite Difference Time Domain (FDTD) methods is presented. It is based on the Auxiliary Differential Equation (ADE) formulation. Accuracy and efficiency are compared to other ADE [...]

Coupled Electro-Mechanical Simulation of Integrated Micro-Electro-Mechanical Systems

Lien H-P, Wiegele T.G., Bomholt L., Ruhl R., Integrated Systems Engineering AG, CH

Micro-electro-mechanical systems equipped with active devices (iMEMS) are commonly employed in sensor applications. In this paper, simulation of the mechanical and electrical properties of a deformable structure containing an integrated MOS sensor is described.

Complete Transient Simulations of Electrostatic Actuators

Cojocaru C., Lerch P., Kloeck B., Bourgeois C., Renaud Ph., EPFL, CH

A code for the dynamical simulation of electrostatic actuated micromechanical systems with complex 3D geometry was created. It allows exact electrical force computation at each time step during the dynamic analyses. A finite element method [...]

Inductance Extraction by Means of the Monte Carlo Method

Leonhardt G., Hager C., Regli P., Fichtner W., ETH-EPFL, CH

This paper presents a novel inductance extraction procedure which is based on a Monte Carlo sampling technique. Partial inductances for static current distributions can be computed efficiently and with small memory requirements, thus enabling the [...]

Augmented Reality as an Interactive Tool for Microscopic Imaging, Measurement and Model Based Verification of Simulated Parts

Sulzmann A., Schütz C., Hügli H., Jacot J., EPFL, CH

Presently microsystems are gaining in interest. Microsystems are small, independent modules, incorporating various functions, such as electronic, micro mechanical, data processing, optical, chemical, medical and biological functions. Though improving the manufacturing technologies, the measuring of [...]

Electro-Thermo-Mechanical Simulations of Aluminum Bond Wires in IGBT-Packages

Hager C., Tronel Y., Fichtner W., ETH-EPFL, CH

Finite-element simulations have been performed on aluminum wires as used in modern IGBT (Insulated Gate Bipolar Transistor) power modules. These wires were ultrasonically bonded to thin molybdenum plates and the influence of different origins of [...]

A Global Finite Element Model for Improving the Thermo-Mechanical Reliability of IBGTs Modules

Tronel Y., Fichtner W., Swiss Federal Institute of Technology Zürich, CH

Insulated Gate Bipolar Transistors (IGBT's) are widely used in the automotive industry as high power current switches. They are currently being introduced into traction applications (locomotives, trams, metros, etc.) where high reliability is extremely important. [...]

CMOS MEMS and their Simulation

Korvink J.G., Emmenegger M., Taschini S., Baltes H., ETH Zürich, CH

The most appropriate tools for the modelling and simulation of MEMS are strongly related to the technology used to fabricate them. CMOS MEMS are naturally combined with circuitry, and in a packaged form they are [...]