Informatics, Electronics and Microsystems: TechConnect Briefs 2018

Chapters:

1. Informatics, Modeling & Simulation
2. Nanoelectronics
3. Printed & Flexible Electronics
4. 3D Printing
5. Advanced Manufacturing Innovation
6. MEMS & NEMS Devices, Modeling & Applications
7. Inkjet Design, Materials & Fabrication
8. Photonic Materials & Devices
9. WCM – Compact Modeling

Journal: TechConnect Briefs
Volume: 4, Informatics, Electronics and Microsystems: TechConnect Briefs 2018
Published: May 13, 2018
ISBN: 978-0-9988782-1-8