Papers – Page 2 – TechConnect Briefs

Enabling Nanofabrication through Dip Pen Nanolithography™

Dip Pen Nanolithography, DPN™, was discovered in the laboratory of Dr Chad Mirkin at Northwestern University leading to the founding of NanoInk, Inc. with a mission to develop, manufacture and advance the process of DPN [...]

Anticipating the Public Backlash: Public Relations Lessons for Nanotechnology from the Biotechnology Experience

Matsuura J.H., University of Dayton School of Law, US

Public concern about the safety of nanotechnology is growing. Whether rationally based, or not, that concern can impede research and commercialization in the nanotechnology industry. This risk parallels problems already encountered by the biotechnology industry, [...]

Novel Approach to Circuit Board Testing

Wright R.G., Kirkland L.V., Zgol M., Adebimpe D., Keenan E., Mulligan R., GMA Industries, Inc., US

Fast, accurate, and inexpensive identification of failed integrated circuits on electronic circuit boards presents a major challenge for the electronic testing industry. In this paper we describe research and development efforts in the application of [...]

Cooling and Power Conversion using Nanometer Gaps

Tavkhelidze A., Cox I., Cool Chips plc, UK

Our nanotech answer to these basic industrial processes is not to make very small turbines or compressors, but instead to take advantage of the physics that occurs at very small sizes. In this case, instead [...]

Atomic Holographic Optical Storage Nanotechnology

Thomas M.E., Colossal Storage Corp., US

Colossal Storage Inc. has exclusive license patent rights on new ways of non - contact reading and writing with non destructive reading of information to a ferroelectric molecule. These methods will be used to develop [...]

Miniaturized High Speed Visualization Setup for the Diagnostics of Dynamical Processes in Microsystems

Brugger H., Maier C., Hofer E.P., University of Ulm, DE

For the real time visualization of the dynamics of MEMS it is often inevitable to use high speed camera systems because of the optical enlargement. The micro diagnostic system MinVis, which consists of a miniaturized [...]

Microcap Selective Packaging through Flip Chip Alignment

Chao C.H., Pan C.T., National Sun Yat-Sen University, TW

In this study, the technique of microcap selective bonding for 3-D microstructures using MEMS processes was presented. The flip-chip assembly was successfully demonstrated that the microcap transferred on the selective area of the host substrate [...]

Interfacial Instabilities in Multilayer Extrusion

Ho K., Lee J.S., Viriyabanthorn N., Sung C., Barry C.M.F., Mead J.L., University of Massachusetts-Lowell, US

Polymeric alternating multilayer laminates have been prepared by coextrusion, utilizing a specially designed feedblock to combine the two incoming materials from different extruder. Layer multiplying elements (LME) were used to split the melt stream, divide [...]

Processing Parameters Affecting Nanoinjection Molding

Srirojpinyo C., Yoon S-H, Lee J., Sung C., Mead J.L., Barry C.M.F., University of Massachusetts-Lowell, US

Although micro parts and features are routinely molded, the performance of polymer melts is not well understood when the part wall thickness is less than 1 mm. In this study, the effects of molding conditions [...]

Investigation of Tooling Surfaces on Injection Molded Nanoscale Features

Yoon S-H, Srirojpinyo C., Lee J., Sung C., Mead J.L., Barry C.M.F., University of Massachusetts at Lowell, US

The composition and surface properties of tooling materials become more critical as the size of the molded features decreases [1, 2]. This work investigates the effect of tooling surfaces with micro and nanoscale features. These [...]