Strength Prediction for MEMS Components Transferring Large Loads

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In this paper the authors present a new strength criteria combined with a finite element analysis to predict the strength of MEMS fabricated microridges. The single crystal silicon microridges can be manufactured by various processes that produce different geometries with distinctly different strengths, a topic verified by experiments. A strength criteria based on strain energy concepts is proposed to evaluate the difference observed in component strength. Agreement between test data and model prediction is good with errors less than 25% and usually less than 5%. Therefore, we believe that a wide range of microcomponent strengths can be predicted by performing a limited number of tests.

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Journal: TechConnect Briefs
Volume: Technical Proceedings of the 1999 International Conference on Modeling and Simulation of Microsystems
Published: April 19, 1999
Pages: 487 - 490
Industry sector: Sensors, MEMS, Electronics
Topic: Modeling & Simulation of Microsystems
ISBN: 0-9666135-4-6