RF passive structures via low temperature direct ink writing of annealing-free composite alloy

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Recent advances in the field of additive manufacturing have utilized electronic circuits to develop high-valued functional devices. Here we present a novel approach to fabricate viscoelastic polymer-free metal ink and RF passive structures via material-extruded based direct ink writing technique. The combination of low melting In-Bi-Sn eutectic alloy and silver-coated Cu micro-particles enables to tune rheological characteristics for printability and shape formation. No post process such as annealing or sintering is required due to purely metal-based composite ink and therefore thermal damage on a substrate is minimized. Passive electromagnetic structures including planar, toroidal, and solenoidal inductors have been created by directly printing the composite alloy ink through the fine nozzles. The ability to configure three-dimensional electronic components has been demonstrated via printing out-of-plane direction with the absence of supporting materials

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Journal: TechConnect Briefs
Volume: 4, Informatics, Electronics and Microsystems: TechConnect Briefs 2018
Published: May 13, 2018
Pages: 110 - 113
Industry sector: Advanced Materials & Manufacturing
Topics: 3D Printing
ISBN: 978-0-9988782-1-8