Development and property modification of composite metal for Material extrusion printed circuit

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Recently, the proportion of 3D printing technology in the electronics industry is expected to average 50% in 2030. It is expected that the 3D printing manufacturing method will be introduced in earnest depending on the development of metal materials for printing. Most of conductive materials for ME based 3D printing are mixture of conductive particles with plastic materials as the base material. Therefore, it is difficult to satisfy the inherent electric conductivity characteristic of the conductive material. Also, the very low electric conduction efficiency per unit volume of the printed pattern is a problem. In this paper, we will discuss a system that can print simple electronics by printing liquid metals based on composite metals, and conductive materials that can form circuit wiring immediately after printing. The melting point of the metal material is remarkably improved so that the metal material can be printed even on the plastic of general ME printing. Also, the electrical properties and rheological behavior of the composite metal may be varied by mixing the additives. Immediately after printing unlike the conductive paste material, the composite metal is electrically connected to the electronic parts and the electrical characteristics are satisfied without post-treatment. Thus, it is possible to propose a manufacturing method of an electronic device capable of immediately printing by utilizing the 3D printing technology. We may expect the bright future of the 3D printing electronics industry by the circuit design that manufactures electronic devices on the spot and breaks the boundaries of the dimension.

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Journal: TechConnect Briefs
Volume: 4, Informatics, Electronics and Microsystems: TechConnect Briefs 2018
Published: May 13, 2018
Pages: 108 - 109
Industry sector: Advanced Materials & Manufacturing
Topic: 3D Printing
ISBN: 978-0-9988782-1-8