Ochoa E.M., Starman_Jr. L.A., Cowan W.D., Nelson_Jr. T.R., Blum Spahn O., Lott J.A.
Air Force Institute of Technology, US
Keywords: hybrid integration, MEMS, tunable filter, tunable VCSEL, WDM
We characterize our novel mechanical structures for flip-bonded hybrid micro-electro-mechanically (MEM) tunable filters (MEM-TF) and MEM-tunable vertical cavity surface emitting lasers (MEM-TVCSELs) by comparing simulations with foundry fabricated actuators. Two of our prototypes, each with different flexure thickness, have analytically simulated and measured pull-in voltages of (11.6 V, 11.8 ± 0.1 V) and (8.4 V, 7.7 ± 0.5 V) respectively. We believe our hybrid approach will reduce cost, shorten development time, enable use of standard flip-chip technology and IC/MEMS foundries, and offer materials flexibility since the components do not need to be lattice matched.
Journal: TechConnect Briefs
Volume: 1, Technical Proceedings of the 2002 International Conference on Modeling and Simulation of Microsystems
Published: April 22, 2002
Pages: 266 - 269
Industry sector: Sensors, MEMS, Electronics
Topic: MEMS & NEMS Devices, Modeling & Applications
ISBN: 0-9708275-7-1