Papers – Page 30 – TechConnect Briefs

The impact of the “4d-Rheoprinting” additive manufacturing technique on molecular orientation and thermal properties of polymeric parts

Duhduh A., Coulter J.P., Lehigh University, US

This paper discusses a novel additive manufacturing technique that was developed in order to 3D print polymeric parts with tunable properties. This technique, known as 4D-Rheoprinting, can be applied to a number of common additive [...]

High power electron gun for metal additive manufacturing based on superconducting technology

Thangaraj J., Fermi National Accelerator Laboratory, US

E-beam additive manufacturing is a rapidly growing industry. Electron guns capable of reaching higher energies and higher average power can enable larger melt pools, higher production speed, and permit broader range of materials for metal [...]

Robotic Deposition to Enable Multi-Axis Material Extrusion

Kubalak J.R., Williams C.B., Virginia Tech, US

The material extrusion (ME) additive manufacturing process is extensively used in hobbyist and prototyping applications, but it is not always suitable for the fabrication of end-use components. The thermal characteristics of the layer-by-layer deposition results [...]

Low transmission loss flexible substrates using low Dk/Df polyimide adhesives

Tasaki T., Arakawa Chemical Industries, Ltd., JP

To meet the ever-increasing requirements of transmission data with a growth in the market for information technology gadgets such as mobile phones, the transmission frequency of circuits is increased. However, the integrity of high-frequency signals [...]

XTPL Approach to Print Submicron Conductive Lines on Dielectric Substrates

Kowalczewski P., Wiatrowska A., Dusza M., Zięba M., Cichoń P., Fijak K., Granek F., XTPL SA, PL

The concepts of printed electronics offer a tremendous potential when brought to nanotechnology. We present a novel technology for printing submicron conductive lines at unprecedented flexibility, accuracy, and low cost. The lines with resistivity down [...]

A Stretching/Bending-Insensitive Flexible Pressure Sensor with Carbon Nanotube-PDMS

Zhang R., Stevens Institute of Technology, US

Flexible pressure sensors have many successful applications in personal electronic devices, artificially intelligence, and industrial production applications [1]. Despite the good performance and high flexibility, the measurement of pressure under dynamic deformation has remained difficult [...]

Self-assembly via a quantum control tracking system

Kohn W., Zabinsky Z., Nerode A., Veritone, US

A nano-manufacturing facility requires high levels of precision due to the strong quantum effects for devices at a 2 to 4 nanometer footprint. We develop a feedback process control to realize a 3-D scaffolding approach. [...]

European Activity for Smart Power Electronics and Power Discretes – The R3-PowerUP EU Project

Bieniek T., Janczyk G., Instytut Technologii Elektronowej, PL

Smart power ICs are key enabling components for various applications from mid-power automotive, to industrial power, battery management systems electric vehicles, domotics, indoor and outdoor lighting, computers and industrial peripherals. Power electronics serves over 30% [...]

The Multifunctional 3D Interposer Platform for HPC – Development, Measurements, Design Guidelines

Janczyk G., Bieniek T., Instytut Technologii Elektronowej, PL

This paper presents dedicated solutions developed in frame of the EU FP7 CarrICool project focused on the modular interposer system architecture providing scalable heat removal, local power delivery and optical signaling issues critical for high [...]

A molecular dynamics study of the causes of defects at dielectric/substrate interface of Ge MOSFETs

Heydari A., Sheikholeslam S.A., Grecu C., Ivanov A., University of British Columbia, CA

The superior electrical properties of Germanium (Ge), such as higher electron and hole mobility, compared to that of other semiconductor materials, have been one of the factors to cause germanium to return to be of [...]