Non traditional dicing of MEMS devices


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Dicing of MEMS contains a host of challenges. Contamination, vibration, thermal, and electrical sensitivity dictate modified or non traditional dicing processes. Focusing a laser beam inside of the silicon substrate creating a modified layer is one such non traditional dicing process. This completely dry process addresses most of the challenges to dicing MEMS. This paper will compare the SD laser process to a modified blade dicing of MEMS.

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Journal: TechConnect Briefs
Volume: 3, Nanotechnology 2008: Microsystems, Photonics, Sensors, Fluidics, Modeling, and Simulation – Technical Proceedings of the 2008 NSTI Nanotechnology Conference and Trade Show, Volume 3
Published: June 1, 2008
Pages: 493 - 496
Industry sector: Sensors, MEMS, Electronics
Topic: MEMS & NEMS Devices, Modeling & Applications
ISBN: 978-1-4200-8505-1