Fritz N., Saha R., Bidstrup Allen S.A., Kohl P.A.
Georgia Institute of Technology, US
Keywords: lead frame packaging, MEMS packaging, polymer air-gap structures
This research looks at using a polymer Air-gap structures as a cost efficient method of wafer and chip level packaging MEMS devices for a wide range of applications. The presentation will describe how this style of package could be used for a large range of devices such as hermetic or fluidic, and air-gap processing advancements for the wafer level package. The cavities are then investigated for lead frame package purposes. This investigation uses both modeling and experimental techniques to determine the design and rigidity of the cavity under the molding pressure.
Journal: TechConnect Briefs
Volume: 2, Nanotechnology 2011: Electronics, Devices, Fabrication, MEMS, Fluidics and Computational
Published: June 13, 2011
Pages: 314 - 317
Industry sectors: Advanced Materials & Manufacturing | Sensors, MEMS, Electronics
Topic: MEMS & NEMS Devices, Modeling & Applications
ISBN: 978-1-4398-7139-3