Engineered Nanostructures for High Thermal Conductivity Substrates

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In the DARPA Thermal Ground Plane (TGP) program, GE and its partners, the University of Cincinnati and the Air Force Research Laboratory, are developing a new thermal technology that will enable a monumental thermal technological leap to an entirely new class of electronics, particularly electronics for use in high-tech military systems. This paper presents results from Phase 1 of this program.

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Journal: TechConnect Briefs
Volume: 3, Nanotechnology 2009: Biofuels, Renewable Energy, Coatings, Fluidics and Compact Modeling
Published: May 3, 2009
Pages: 505 - 508
Industry sectors: Advanced Materials & Manufacturing | Sensors, MEMS, Electronics
Topics: Micro & Bio Fluidics, Lab-on-Chip
ISBN: 978-1-4398-1784-1