Kain A., Mueller C., Reinecke H.
University of Freiburg, DE
Keywords: hot melt ink, ink-jet, printing technology
This paper presents a hot melt printing technology which provides a customer-focused batch production for circuit layers assembly, silicon surface structuring and 3-dimensional surface modification. By the forming properties of hot melt inks and in combination with mold and die production processes of Microsystems Engineering also the fabrication of solid tools and prototypes are possible. Via the direct conversion from software data into a printed dot pattern, without the need of conventional lithography processes or mechanical processing, a fast and cost-efficient fabrication process for prototype manufacture and batch volume production can be establish.
Journal: TechConnect Briefs
Volume: 2, Nanotechnology 2010: Electronics, Devices, Fabrication, MEMS, Fluidics and Computational
Published: June 21, 2010
Pages: 552 - 555
Industry sectors: Advanced Materials & Manufacturing | Sensors, MEMS, Electronics
Topic: Inkjet Design, Materials & Fabrication
ISBN: 978-1-4398-3402-2