Athavale M.M., Yang H.Q., Przekwas A.J.
CFD Research Corporation, US
Keywords: coupled field simulation, fluid, microchannels., microvalves, structural, thermal
This paper presents the results of high-fidelity, 3-D simulations of coupled flow, heat-transfer and structural mechanics simulations of microchannels, micropumps, microvalves, and time-accurate simulations of a microoscillator. In each of these cases, the simulated results were compared with experimental and/or other published data, with excellent agreement. These results demonstrate the capabilities, accuracy and speed of the simulation tools for predictions of coupled, complex multi-physics processes in MEMS devices and their utility during the design phases of these devices for optimization and performance prediction.
Journal: TechConnect Briefs
Volume: Technical Proceedings of the 1999 International Conference on Modeling and Simulation of Microsystems
Published: April 19, 1999
Pages: 570 - 573
Industry sector: Sensors, MEMS, Electronics
Topics: Micro & Bio Fluidics, Lab-on-Chip, Modeling & Simulation of Microsystems
ISBN: 0-9666135-4-6