Amin S., Amin Y., Tenhunen H., Zheng L-R, Duo X., Amin S., Amin Y.
University of Engineering and Technology Taxila, PK
Keywords: chip package co-design, front-end, MCM
The transceivers for future technology (third generation cellular, wireless LAN) need to be portable (compact), battery-powered and wireless. The present single-chip solutions for RF front-ends do not yield complete system integration. A system-on-a-package (SoP) approach can solve these problems. High quality components can be integrated in the package. This paper reports a fully integrated single-package RF prototype module for a 5 GHz WLAN receiver front-end, which is intended to demonstrate the concept of SoP integration. The approach that is illustrated here is implemented with a thin film multichip module (MCM-D) interconnect technology. This technology also allows the integration of high quality passive components. With these passives, low-loss filters can be implemented.
Journal: TechConnect Briefs
Volume: 3, Technical Proceedings of the 2005 NSTI Nanotechnology Conference and Trade Show, Volume 3
Published: May 8, 2005
Pages: 415 - 418
Industry sector: Sensors, MEMS, Electronics
Topics: MEMS & NEMS Devices, Modeling & Applications, Sensors - Chemical, Physical & Bio
ISBN: 0-9767985-2-2