Accurate Lumped-Parameter modeling for Dynamic Simulation of Electrostatic MEMS Actuators

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This paper introduces a novel approach of accurately modeling electrostatically actuated MEMS structures, using a lumped parameter electrical analogy based on voltage controlled de.es in Spice. This analysis takes into account the changes in capacitive force and squeeze film damping because of movement of the structures, by modeling them by voltage controlled devices in Spice. The value of the spring constant and the capacitance, as a function of airgap between parallel plates is derived from commercially available CAD tools by static analysis of the MEMS structures. The speed of actuation and movement of the electrostatic MEMS devices, on applying a pulse voltage is simulated using HSpice. This paper provides a way of cosimulating digital, analog and sensor/actuator parts put together, on a single System on a chip.

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Journal: TechConnect Briefs
Volume: Technical Proceedings of the 1998 International Conference on Modeling and Simulation of Microsystems
Published: April 6, 1998
Pages: 278 - 282
Industry sector: Sensors, MEMS, Electronics
Topic: Modeling & Simulation of Microsystems
ISBN: 0-96661-35-0-3