Rencz M., Székely V., Kohári Zs., Courtois B.
Micred Ltd., HU
Keywords: package models, reduced order models, thermal models
MEMS applications are frequently thermally operated, so knowing the thermal characteristics of their packages is very important. This paper presents a method for the generation of reduced order dynamic thermal models, either from simulated or from measured transient results. The applicability of the method is presented on a benchmark package used for (pressure) sensor applications.
Journal: TechConnect Briefs
Volume: Technical Proceedings of the 2000 International Conference on Modeling and Simulation of Microsystems
Published: March 27, 2000
Pages: 209 - 212
Industry sector: Sensors, MEMS, Electronics
Topic: Modeling & Simulation of Microsystems
ISBN: 0-9666135-7-0