A Fluoro-ethoxysilane-Based Stiction-Free Release Process for Submicron Gap MEMS

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Nowadays, stiction remains one of the biggest reliability problems in the fabrication of micro-electromechanical systems (MEMS), especially when a small gap is used. To avoid the adhesion, a Self-Assembled Monolayer (SAM) can be coated. Main research in that field focuses on aliphatic chloro-silanes. We developed a novel wet-release CMOS compatible process for the fabrication of surface-micromachined beam using a perfluorated SAM. Uniform 9 Å thick monolayers were observed. A static contact angle of 121° was measured. Furthermore, a complete 1 µm thick (gap 0.5 µm) polysilicon RF MEMS capacitor with aluminium interconnects realized with this process demonstrated the CMOS compatibility.

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Journal: TechConnect Briefs
Volume: 1, Technical Proceedings of the 2003 Nanotechnology Conference and Trade Show, Volume 1
Published: February 23, 2003
Pages: 522 - 525
Industry sector: Sensors, MEMS, Electronics
Topics: Advanced Manufacturing, Nanoelectronics
ISBN: 0-9728422-0-9