Bharatan S., Welch P., To K.H., Thoma R., Huang M.
Motorola, Digital DNA Laboratories, US
Keywords: compact modeling, on-chip crosstalk, signal isolation, substrate coupling
In this paper, we present a practical methodolgy for the 3-dimensional simulation of signal isolation structures along with comparison to measurements made on test structures. We also describe the extraction of a scalable compact model for isolation structures. Such SPICE models are mandatory during the design process for predicting the effect of substrate noise generated by digital circuit blocks on highly sensitive low noise amplifiers in the RF and IF range.
Journal: TechConnect Briefs
Volume: 1, Technical Proceedings of the 2001 International Conference on Modeling and Simulation of Microsystems
Published: March 19, 2001
Pages: 470 - 473
Industry sector: Sensors, MEMS, Electronics
Topic: Modeling & Simulation of Microsystems
ISBN: 0-9708275-0-4