wettability – TechConnect Briefs

1D Multi-Structured Micro/nanomaterials with Special Wettability

Zhao Y., Beihang University, CN

With the progresses in material sciences, the generation of microscopic materials experiences an architectural evolution process from simple to complex. The complex interior structures will enable such materials a number of potential applications. Here we [...]

Photo-induced Surface Modification of Polyimides for Printable Electronics Fablication

Yamashita T., Kodara F., Mino M., Matsuzawa Y., Okano K., Tokyo University of Science, JP

Manufacturing devices with printing technique is one of the key steps in developing printable and flexible electronics or photonics technology. But printing fine structure with ink jet technique is relatively limited because positional precision and [...]

Tuning Wettability of Electrospun Three-dimensional Scaffolds through Morphology Control

Ahmed F., Choudhury N.R., Dutta N.K., University of South Australia, AU

Surface wettability plays an important role in determining implant’s fate due to direct influence of protein/biomolecule adsorption that governs cell adhesion. The importance of the physical parameters, such as, overall porosity, pore directionality, difference between [...]

Surface modification of powders and nanostructure deposition in the afterglow of a low power barrier discharge at atmospheric pressure

Sonnenfeld A., Reichen P., von Rohr Ph.R., ETH Zürich, CH

The precipitation of solid-state sphere-like nanostructures from an organosilicon precursor at atmospheric pressure is investigated in the prospect of the improvement of powder flowability by the attachment of nanoscopic spacers to the powder particles surfaces. [...]

Fabrication of superhydrophobic nanostructured films by Physical Vapour Deposition

Yoldi M., García J.A., Rodríguez R.J., Rico M., AIN, ES

This work reports on recent advances in the deposition of non-wettable coatings with high water contact angles (WCAs). We propose a simple and easily-controlled method for fabricating different types of nanoestructured films with hydrophobic properties [...]

Engineered Nanostructures for High Thermal Conductivity Substrates

Varanasi K.K., Chamarthy P., Chauhan S., de Bock P., Kulkarni A., Mandrusiak G., Rush B., Russ B., Denault L., Weaver S., Gerner F., Leland Q., Yerkes K., Massachusetts Institute of Technology, US

In the DARPA Thermal Ground Plane (TGP) program, GE and its partners, the University of Cincinnati and the Air Force Research Laboratory, are developing a new thermal technology that will enable a monumental thermal technological [...]