Active Sealing for Soft Poymer Microchips
Bang H., Lee J., Lee W.G., Park J., Yun H., Lee J., Lee W.G., Chung C., Chung S., Cho K., Chung C., Chung S., Han D-C, Chang J.K., Seoul National University, KR
This paper presents a universal sealing method for soft polymer (elastomer) microchips. A robust and reversible sealing method which allows various materials to be bonded and sealed tightly with each other even in aqueous solutions, [...]