Design and Characterization of new GaAs Micromechanical Thermal Converter developed for Microwave Power Sensor
Jakovenko J., Husak M., Lalinsky T., Czech Technical University in Prague, Faculty of Electrical Engineering, CZ
In this report we demonstrate the design of new GaAs based Micromechanical thermal converter (MTC) that creates heart of the RF power sensor microsystem. Transmitted power is the main quantity measured in RF systems. The [...]