Ultra Thin Packaging of the RF-MEMS Devices with Low loss
Park H-W., Park Y.K., Kim C.J., Kim H., Kim Y.K., Kim C.J., Kim H., Kim Y.K., Lee D.J., Park H-W., Park Y.K., Kim C.J., Kim H., Kim Y.K., Ju B.K., Korea Institute of Science and Technology, KR
RF-MEMS devices have the potential for providing an overarching circuit integration technology that can significantly reduce the size, weight and cost. In this research, as ultra thin silicon substrate which has thickness of 50um was [...]