TechConnect Briefs
MENU
  • Briefs Home
  • Volumes
  • About ►
    • TechConnect Briefs
    • Submissions
    • Editors
  • TechConnect
  • Briefs Home
  • Volumes
  • About
    • TechConnect Briefs
    • Submissions
    • Editors
  • TechConnect
HomeKeywordsmethodology

Keywords: methodology

An SOA Aware MOSFET Model for Highly Integrated, Analog Mixed-Signal Design Environments

Hall J., Luo Z., Xiao Y., Young A., Connerney D., Fairchild Semiconductor, US
Circuit simulations involving power devices often require additional checks comparing with generic low power applications. The burden lies with the individual designers to ensure that the power transistors are operating well within the Safe Operating [...]

Computer-Based Process Design Support for MEMS

Wagener A., Popp J., Schmidt T., Hahn K., University of Siegen, DE
A process management and development system for MEMS design is introduced. It allows the specification of processes for specific applications and the tracking of the development procedures. Unlike in microelectronics the process configuration for MEMS [...]

Methodology of Macromodeling Demonstrated on Force Feedback S/D-Architectures

Hardtmann M., Aigner R., Nadal R., Wachutka G., Münich University of Technology, DE
Design and verification of complete microsystems require effective models of the micromechanical components for the simulation at system level. Particularly for force feedback S/D-architectures, long transient simulations are inevitable to characterize the system-inherent signal pro-cessing. [...]

Parameterized Electrostatic Gap Model for Structured Design of Microelectroelectrical Systems

Lu M.S., Fedder G.K., Carnegie Mellon University, US
VLSI system designers can begin their design process with a behavrioal description of a system, then proceed to physical design. MEMS designers typiclly begin with device design, this process is opten followed by several fabrication [...]

A Methodology for System Level Simulation, Modeling and Optimization of MEMS Devices

Nguyen L., Lee H.J., Maher M.A., von Sosen H., Tanner Research, Inc., US
A Methodology for System Level Simulation, Modeling and Optimization of MEMS Devices Categories: Co-simulation and Optimization System, Multi-level Modeling Linh Nguyen, Hee Jung Lee, Mary Ann Maher, and Harald von Sosen Tanner Research, Inc. VLSI [...]

About TechConnect Briefs

TechConnect Briefs is an open access journal featuring over 10,000 applications-focused research papers, published by TechConnect and aligned with over 20 years of discovery from the annual Nanotech and the TechConnect World Innovation Conferences.

Full Text Search

TechConnect World

June 17-19, 2024 • Washington, DC

TechConnect Online Community

» Free subscription!

Topics

3D Printing Advanced Manufacturing Advanced Materials for Engineering Applications AI Innovations Biofuels & Bioproducts Biomaterials Cancer Nanotechnology Carbon Capture & Utilization Carbon Nano Structures & Devices Catalysis Chemical, Physical & Bio-Sensors Coatings, Surfaces & Membranes Compact Modeling Composite Materials Diagnostics & Bioimaging Energy Storage Environmental Health & Safety of Nanomaterials Fuel cells & Hydrogen Graphene & 2D-Materials Informatics, Modeling & Simulation Inkjet Design, Materials & Fabrication Materials Characterization & Imaging Materials for Drug & Gene Delivery Materials for Oil & Gas Materials for Sustainable Building MEMS & NEMS Devices, Modeling & Applications Micro & Bio Fluidics, Lab-on-Chip Modeling & Simulation of Microsystems Nano & Microfibrillated Cellulose Nanoelectronics Nanoparticle Synthesis & Applications Personal & Home Care, Food & Agriculture Photonic Materials & Devices Printed & Flexible Electronics Sensors - Chemical, Physical & Bio Solar Technologies Sustainable Materials Water Technologies WCM - Compact Modeling
MENU
  • Sitemap
  • Contact
  • Sitemap
  • Contact

Copyright © TechConnect a Division of ATI | All rights reserved.