macromodel – TechConnect Briefs

Automatically Generated and Experimentally Validated System-Level Model of a Microelectromechanical RF Switch

Niessner M., Schrag G., Wachutka G., Iannacci J., Margesin B., Münich University of Technology, DE

In this work, we present a mixed-level model of an electrostatically actuated and viscously damped ohmic radio frequency (RF) microelectromechanical switch, which provides an accurate physical description of the device behavior and is suitable for [...]

Macromodeling for Microfluidic Channels

Kuo C-W, Chein C-M, Yang Y-J, National Taiwan University, TW

In this paper, we present a methodology of generating microfluidic macromodels (reduced-order models) for 3-D non-linear microchannels. Compared with the full-meshed simulations, the generated macromodels not only provide accuracy results, but also give three-orders-of-magnitude speed-ups. [...]

Heat Transfer Macromodels for MEMS Devices with 3D Geometries

Yu C-C, Yang Y-J, National Taiwan University, TW

There are numerous heat transfer applications in MEMS, such as thermal actuating, uncooled infrared sensing, chip cooling, temperature sensing, PCR, and so on. Most of the applications need feedback loops for precise control or actuation, [...]

Time-Domain Reduced-Order Models of Lateral Viscous Damping Effects for 3-D Geometries

Yen P-C, Yang Y-J, National Taiwan University, TW

A methodology of generating time-domain reduced-order models of viscous lateral damping effects for microsystems is presented. A three-dimensional finite-difference-method (FDM) Stokes flow solver was developed and verified. The system matrices generate by the solver were [...]

Investigation of Cross-Coupling and Parasitic Effects in Microelectromechanical Devices on Device and System Level

Schrag G., Zelder G., Wachutka G., Münich University of Technology, DE

With progressing monolithic integration of entire micro-electromechanical systems on one chip fabricated by standard IC technology we have to cope with the problem that the operation of embedded transducer elements is considerably affected by cross-coupling [...]