lead-free solder – TechConnect Briefs

Effect of IMC thickness on thermo-mechanical reliability of lead-free solder joints in solar cell assembly

Zarmai M.T., Ekere N.N., Oduoza C.F., Amalu E.H., University of Wolverhampton, UK

The fatigue failure of lead-free SnAgCu solder joints in solar cell assembly is studied to determine the effect of thickness of intermetallic compound (IMC) layer on the reliability of the joints. Finite element modelling (FEM) [...]

A Study of Molten Lead-Free Solder Deposited by Inkjet Printing for Interconnections of Thin-Film Solar Cell Modules

Chen W-M, Wang C-H, Hwang W-S, National Cheng Kung University, TW

Solar cell modules generally are bonded with photovoltaic ribbon using silver paste to increase photovoltaic conversion efficiency. However, the joint strength of silver paste between the aluminum back electrode and the ribbon may be the [...]

nanoCopper based solder-free electronic assembly material

Zinn A., Stoltenberg R., Lockheed Martin Space Systems Company Adv. Technol. Center, US

The Advanced Technology Center of the Lockheed Martin Corporation developed a copper-based electrical interconnect material that can be processed at 200 °C, dispensed using 75 micron size syringe tips and has shown electrical & thermal [...]

Using Nanoparticles and Carbon Nanotubes to Enhance the Properties of a Lead-free Solder

Nai S.M.L., Han Y.D., Jing H.Y., Tan C.M., Wei J., Gupta M., Singapore Institute of Manufacturing Technology, SG

Solders are used in various levels of electronic assembly sequence, whereby good electrical, thermal and mechanical performances of solder are necessary. With miniaturization of devices, diverse functional requirements and ever-stricter operating environments of devices, the [...]