fracture mechanics – TechConnect Briefs

The fracture behavior of SiC/Cu interpenetrating phase nanocomposites: A molecular dynamics study

Shadlou S., University of Saskatchewan, CA

Owing to their high strength, good abrasion resistance, low density, high melting temperature, and other interesting characteristics, ceramics have been extensively used in a wide range of industries [1]. However, one of the major drawbacks [...]

Nanoscale deformation analysis for fracture mechanical evaluation of interface cracks in electronic packages

Keller J., Schulz M., Mrossko R., Wunderle B., Michel B., AMIC Angwandte Micro-Messtechnik GmbH, DE

The ongoing development of highly integrated electronic packages leads to a steadily increasing number of material interfaces within a package. In combination with increasing harshness (vibration, humidity, temperature) of the system environment the reliability of [...]

Fracture mechanical test methods for interface crack evaluation of electronic packages

Keller J., Maus I., Pape H., Wunderle B., Michel B., AMIC Angewandte Micro-Messtechnik GmbH, DE

The ongoing development of highly integrated electronic packages leads to a steadily increasing number of material interfaces within a package. In combination with increasing harshness (vibration, humidity, temperature) of the system environment the reliability of [...]

An Analytical Model for Multi-layer and Multi-electrode Piezoelectric Ceramic Actuators

Wang B-L., Mai Y-W., The University of Sydney, AU

The use of piezoelectric ceramics in multilayer actuator is increasing. This paper studies electroelastic field concentrations ahead of electrodes for multilayer piezoelectric actuators. The electrodes are vertical to and terminated near the edges of the [...]

Multivariant Measurements for Thin Film Adhesion as a Function of Temperature and Thin Film Thickness

Chiang M., Song R., Karim A., Amis E.J., National Institute of Standards and Technology, US

The progress of a proposed high-throughput combinatorial approach to the edge delamination test is reported. This approach can construct the adhesion reliability, as a function of temperature and film thickness (in the sub-micron range) in [...]