Fourier-Kirchhoff – TechConnect Briefs

3-D Thermal Simulator Dedicated for Modern Silicon Structures

Zubert M., Raszkowski T., Janicki M., Samson A., Jankowski M., Napieralski A., Lodz University of Technology, PL

The accurate thermal modelling of nanoscale chips is of vital importance, as heat dissipation is arguably one of the most important problems in modern integrated circuits. As the technology node is expected to continue to [...]

The Heat transfer in Fin-FET transistor

Zubert M., Janicki M., Raszkowski T., Samson A., Napieralski A., Lodz University of Technology, PL

The electro-thermal analysis is one of the most important development steps in the professional design of analogue submicron electric ICs, power modules design process as well as modern nanostructures. This analysis is useful to power [...]