fabrication – Page 2 – TechConnect Briefs

Fabrication of QD structures showing diode characteristics for electroluminescence (EL) and other applications

AlAmoody F., Rodriguez A., Papadimitrakopoulos F., Huang W., Ayers J., Jain F., University of Connecticut, US

The abstract talks about the estimation of the size of the cladded dots which are then used in fabrication of a diode like structure. It also talks about the nucleation of the dots with varying [...]

Stacked Coupled-Disk MEMS Resonators for RF Applications

Nygaard K.H., Grinde C., Fjeldly T.A., Norwegian University of Science and Technology, NO

A novel, stacked coupled-disk resonator design is presented where the silicon discs vibrate in radial contour modes, actuated by electrodes wrapped around the disk periphery. The self-aligned, central stem mediates the coupling and also anchors [...]

Fabrication & Integration of nanobolometer sensors on a MEMs process

Gilmartin S.F., Arshak A., Arshak K., Collins D., Bain D., Lane W.A., Korostynska O., Arshak A., Arshak K., McCarthy B., Newcomb S.B., Analog Devices, IE

In this paper, we report the fabrication of novel nanoscale bolometer sensor devices using conventional titanium and titanium-nitride metal films, with total bolometer film thicknesses ranging from 60-150nm. The bolometer devices we present are integrated [...]

Fabrication of 1D nanochannels with thin glass wafers for single molecule studies

Hoang H., Segers-Nolten I., Tas N., de Boer M., Subramaniam V., Elwenspoek M., Mesa+ Institute for Nanotechnology, NL

1D nanochannels are fabricated by direct bonding between the silicon wafer containing the nanochannels, microchannels, access holes and the blank thin glass of 170 µm thickness. The thin glass wafers are used as channel covers [...]

Programmable Three-Dimensional Microfluidic Fabrication by Direct-Write Assembly

Ghafar-Zadeh E., Therriault D., Sawan M., École Polytechnique de Montréal, CA

There are increasing needs for 3D microfluidic components such as microchannels, micromixers or micropumps for Laboratory-on-chip systems. To date, several efficient, but expensive and complex techniques such as Liga and micro-stereo-lithography [1] have been developed [...]

Effect of Fin Angle on Electrical Characteristics of Nanoscale Bulk FinFETs

Li Y., Chen W-H, National Chiao Tung University, TW

Bulk-finFET (fin-shaped field effect transistor) has been viewed as a good candidate for nanoscale VLSI device fabrication and nanoelectronic circuit design [1-5]. The structure features an excellent device characteristics compared with conventional planer structures. In [...]

Microfluidics and Rheology of Carbon Black Dilute Suspensions: Modeling, Measurement, and Applications

Aramphongphun C., Hemminger O., Castro J.M., Lee L.J., The Ohio State University, US

Rheology and microfluidics are essential and challenging topics in designing microfluidic devices and materials processing. A study of rheological properties (e.g. viscosity) of complex fluids becomes more important in the flow at microscale due to [...]

Capillary filling speed in silicon dioxide nano-channels

Jarlgaard S.E., Mikkelsen M.B.L., Skafte-Pedersen P., Bruus H., Kristensen A., Technical University of Denmark, DK

We present a simple silicon-based fabrication technique for nanocapillaries based on controlled growth of silicon-dioxide, UV lithography, etching with etch-stop, and glass wafer bonding. Our approach improves state-of-the-art with respect to the obtained cross-wafer homogeneity [...]

Influence of photo-initiator concentration on residual mechanical stress in SU-8 thin films

Psoma S.D., Jenkins D.W.K., Derbyshire G.E., Stevens R., CCLRC RUTHERFORD APPLETON LABORATORY, UK

The negative photoresist SU-8 is widely used in the development and fabrication of MEMS devices. The structures of the resist are the product of photochemical and thermal cationic processes and result in vertical sidewalls and [...]

A Parallel Intelligent OPC Technique for Design and Fabrication of VLSI Circuit

Yu S-M., Li Y., National Chiao Tung University, TW

Optical lithography is the key technology used in very large scale integrated (VLSI) circuit and systemon- a-chip (SoC) fabrication [1-3]. The exposure on wafer has distortions due to the proximity effects. Hence, a correction of [...]