TechConnect Briefs
MENU
  • Briefs Home
  • Volumes
  • About ►
    • TechConnect Briefs
    • Submissions
    • Editors
  • TechConnect
  • Briefs Home
  • Volumes
  • About
    • TechConnect Briefs
    • Submissions
    • Editors
  • TechConnect
HomeKeywordsDMA

Keywords: DMA

Development of alternative binder for lithium ion battery based on epoxy resin

Bunzel F., Wagner M., Stammen E., Dilger K., Technische Universität Braunschweig, DE
The development of batteries for the e-mobility continuously creates new challenges for the researchers. To improve performance of lithium ion batteries, different approaches might be considered. Therefore the Institute of Joining and Welding (ifs) focuses [...]

Mechanical Characteriztion of XD-Grade Carbon Nanotube/Epon 862 Processed by Dual Phase Dispersion Technique

Hossain M.K., Okoro C., Hosur M., Jeelani S., Rangari V., Tuskegee University, US
In this research, a dual-phase dispersion method is studied combining a high intensity ultrasonic liquid processor with a three roll milling technique. Xd-grade carbon nanotubes (xd-CNTs) were infused into Epon 862 epoxy and then mixed [...]

Fabrication and Thermomechanical Characterization of CNF-Filled Polyester and E-Glass/Polyester Nanophased Composites

Hossain M.E., Hossain M.K., Hossain M.E., Hossain M.K., Hosur M., Jeelani S., Rangari V., Tuskegee University, US
A high intensity ultrasonic liquid processor was used to infuse CNFs into the polyester matrix which was then mixed with catalyst using a high speed mechanical agitator. Results showed the significant improvement of mechanical properties [...]

An Evaluation of a Scanning Mobility Particle Sizer with NIST-Traceable Particle Size Standards

Vasiliou J., Duke Scientific Corporation, US
A scanning mobility particle sizer (TSI Model 3936) was evaluated using Duke Scientific NIST traceable particle size standards as well as NIST SRM’s. The importance of instrument setup, electrospray operation and sample preparation for polystyrene [...]

About TechConnect Briefs

TechConnect Briefs is an open access journal featuring over 10,000 applications-focused research papers, published by TechConnect and aligned with over 20 years of discovery from the annual Nanotech and the TechConnect World Innovation Conferences.

Full Text Search

TechConnect World

June 17-19, 2024 • Washington, DC

TechConnect Online Community

» Free subscription!

Topics

3D Printing Advanced Manufacturing Advanced Materials for Engineering Applications AI Innovations Biofuels & Bioproducts Biomaterials Cancer Nanotechnology Carbon Capture & Utilization Carbon Nano Structures & Devices Catalysis Chemical, Physical & Bio-Sensors Coatings, Surfaces & Membranes Compact Modeling Composite Materials Diagnostics & Bioimaging Energy Storage Environmental Health & Safety of Nanomaterials Fuel cells & Hydrogen Graphene & 2D-Materials Informatics, Modeling & Simulation Inkjet Design, Materials & Fabrication Materials Characterization & Imaging Materials for Drug & Gene Delivery Materials for Oil & Gas Materials for Sustainable Building MEMS & NEMS Devices, Modeling & Applications Micro & Bio Fluidics, Lab-on-Chip Modeling & Simulation of Microsystems Nano & Microfibrillated Cellulose Nanoelectronics Nanoparticle Synthesis & Applications Personal & Home Care, Food & Agriculture Photonic Materials & Devices Printed & Flexible Electronics Sensors - Chemical, Physical & Bio Solar Technologies Sustainable Materials Water Technologies WCM - Compact Modeling
MENU
  • Sitemap
  • Contact
  • Sitemap
  • Contact

Copyright © TechConnect a Division of ATI | All rights reserved.