TechConnect Briefs
MENU
  • Briefs Home
  • Volumes
  • About ►
    • TechConnect Briefs
    • Submissions
    • Editors
  • TechConnect
  • Briefs Home
  • Volumes
  • About
    • TechConnect Briefs
    • Submissions
    • Editors
  • TechConnect
HomeKeywordsCV

Keywords: CV

Fabrication of Electroless Plated Nano Porous Gold Film for Trace Heavy Metal Ion Detection In Sensor Applications

Bhagavathula S., Ramanan S.R., Kim S.K., Krishnan J.N., BITS Pilani, K. K. Birla Goa Campus, IN
Nano porous gold film was fabricated by electroless plating with Potassium Gold Cyanide as plating solution. E-beam deposited Cu substrates were chosen for plating. The electroless plated gold was investigated through XRD and SEM. SEM [...]

Implications of Gate Tunneling and Quantum Effects in the Gate-Channel Stack

Dutton R.W., Choi C-H, Stanford University, US
Simulation and modeling of gate tunneling current for thin-oxide MOSFETs and Double-Gate SOIs are discussed. Guidelines for design of leady MOS capacitors are proposed. Resonant gate tunneling current in DG SOI is simulated, based on [...]

Implications of Gate Tunneling and Quantum Effects in the Gate-Channel Stack

Dutton R., Choi C-H, Stanford University, US
Simulation and modeling of gate tunneling current for thin-oxide MOSFETs and Double-Gate SOIs are discussed. Guidelines for design of leady MOS capacitors are proposed. Resonant gate tunneling current in DG SOI is simulated, based on [...]

Simple Method of Characterizing CMOS Channel Dopant Profiles Using CV Technique

Kapila D., Kulkarni M., Fernando C., Davis J., Vasanth K., Pollack G., Texas Instruments, Inc., US
In CMOS process and device simulations, characterization of complete dopant profiles in the channel region is essential for accurate simulations. We have developed a simple, fast and inexpensive methodology for characterizing CMOS channel dopant profiles [...]

About TechConnect Briefs

TechConnect Briefs is an open access journal featuring over 10,000 applications-focused research papers, published by TechConnect and aligned with over 20 years of discovery from the annual Nanotech and the TechConnect World Innovation Conferences.

Full Text Search

TechConnect World

June 17-19, 2024 • Washington, DC

TechConnect Online Community

» Free subscription!

Topics

3D Printing Advanced Manufacturing Advanced Materials for Engineering Applications AI Innovations Biofuels & Bioproducts Biomaterials Cancer Nanotechnology Carbon Capture & Utilization Carbon Nano Structures & Devices Catalysis Chemical, Physical & Bio-Sensors Coatings, Surfaces & Membranes Compact Modeling Composite Materials Diagnostics & Bioimaging Energy Storage Environmental Health & Safety of Nanomaterials Fuel cells & Hydrogen Graphene & 2D-Materials Informatics, Modeling & Simulation Inkjet Design, Materials & Fabrication Materials Characterization & Imaging Materials for Drug & Gene Delivery Materials for Oil & Gas Materials for Sustainable Building MEMS & NEMS Devices, Modeling & Applications Micro & Bio Fluidics, Lab-on-Chip Modeling & Simulation of Microsystems Nano & Microfibrillated Cellulose Nanoelectronics Nanoparticle Synthesis & Applications Personal & Home Care, Food & Agriculture Photonic Materials & Devices Printed & Flexible Electronics Sensors - Chemical, Physical & Bio Solar Technologies Sustainable Materials Water Technologies WCM - Compact Modeling
MENU
  • Sitemap
  • Contact
  • Sitemap
  • Contact

Copyright © TechConnect a Division of ATI | All rights reserved.