chromatography – TechConnect Briefs

Helping nano-entities discover their nano-identity

Castro A., Leeman M., Runyon J.R., Nilsson L., Ulmius Storm M., SOLVE Research and Consultancy AB, SE

Nanoscale materials are becoming increasingly prevalent in our lives. The strategies required to characterize the properties and performance of nanoscale materials can be as unique as the material itself. We have experienced that separation of [...]

STARBONS®: Preparation, applications and transition from laboratory curiosity to scalable product

Shuttleworth P.S., Budarin V.L., Breeden S.W., Luque R.L., White R., Clark J.H., University of York, UK

Starbons® are a novel family of mesoporous materials derived from polysaccharides, which have surface tunable functionalities ranging from hydrophilic to hydrophobic. This novel Starbon® technology utilizes the natural ability for polysaccharides to retain their organized [...]

STARBONS®: Preparation, applications and transition from laboratory curiosity to scalable product

Shuttleworth P.S., Budarin V.L., Breeden S.W., Luque R.L., White R., Clark J.H., University of York, UK

Starbons® are a novel family of mesoporous materials derived from polysaccharides, which have surface tunable functionalities ranging from hydrophilic to hydrophobic. This novel Starbon® technology utilizes the natural ability for polysaccharides to retain their organized [...]

Self-assembly of Carbon Nanotubes on Large Structures and on Ceramics

Karwa M., Brukh R., Saridara C., Wang Y., Iqbal Z., Mitra S., New Jersey Inst. of Technology, US

Self-assembly techniques as related to carbon nanotubes (CNTs) is explored. The first is the self-assembly on the inside wall of stainless steel tubings using C2H4 as the carbon source and the iron nanostructures in the [...]

Wireless Integrated MicroSystems (WIMS): Coming Revolution in the Gathering of Information

Wise K.D., University of Michigan, US

This paper discusses recent developments in microsystems, including progress in low power sensing, circuit integration, wireless interfaces, and wafer-level packaging. Increasingly, such systems are realized on two or three chips in stacked configurations or embedded [...]