Chip Package Co-design of 5GHz RF Receiver Front-End using Multichip Module Technology
Amin S., Amin Y., Tenhunen H., Zheng L-R, Duo X., Amin S., Amin Y., University of Engineering and Technology Taxila, PK
The transceivers for future technology (third generation cellular, wireless LAN) need to be portable (compact), battery-powered and wireless. The present single-chip solutions for RF front-ends do not yield complete system integration. A system-on-a-package (SoP) approach [...]