Winkler T. – TechConnect Briefs

Reliability Analysis of Low Temperature Low Pressure Ag-Sinter Die Attach

Mrossko R., Oppermann H., Wunderle B., Winkler T., Michel B., Berliner Nanotest und Design GmbH, DE

The amount of heat which has to be dissipated from power electronics and microprocessors increases more and more due the ongoing miniaturization. Therefore new interface materials with high electrical and thermal conductivity have to be [...]

Networking in Micro/Nano Reliability Research Encouraged by EUCEMAN, the European Center for Micro- and Nanoreliability

Michel B., Hammacher J., Winkler T., Kaulfersch E., Fraunhofer ENAS, DE

Based on the conviction that advanced micro and nanotechnologies are continuing to have an ever stronger influence in all spheres of human life and will permeate them even more fully in the future, without, conversely, [...]