Wang C-H – TechConnect Briefs

A Study of Molten Lead-Free Solder Deposited by Inkjet Printing for Interconnections of Thin-Film Solar Cell Modules

Chen W-M, Wang C-H, Hwang W-S, National Cheng Kung University, TW

Solar cell modules generally are bonded with photovoltaic ribbon using silver paste to increase photovoltaic conversion efficiency. However, the joint strength of silver paste between the aluminum back electrode and the ribbon may be the [...]

Experimental and Numerical Studies of Droplet and Particle Formation in Electrohydrodynamic Atomization

Hua J., Lim L.K., Wang C-H, Institute of High Performance Computing, SG

Electrohydrodynamic Atomization (EHDA) is a method to disperse liquid jet into micro- droplets where an electrical field is applied to control the breakup characteristic of the liquid jet. Recent studies show that EHDA method is [...]

Synthesis of uniform ZnO nanowire arrays over a large area

Wang C-H, Yang J., Shum K., Salagaj T., Ren Z.F., Tu Y., First Nano, US

It has been found that Zinc oxide (ZnO) nanowires have great potential in many applications. Currently, the most commonly used method to grow ZnO nanowires is to use the vapor transport method. The morphology of [...]

RF Measurement Techniques for Micro-Cantilever Characterization and Application

Wang C-H, Weber R.J., Iowa State University, US

The reflection coefficient (S11) of a one-port device is most sensitive to its input impedance if a matched condition is obtained. This implies two methods to measure the deflection-induced impedance change for a 1-port device [...]