Vinay A. – TechConnect Briefs

In-plane and Out-Of-Plane Mechanical Characterization of Thin Polysilicon

Cacchione F., De Masi B., Corigliano A., Ferrera M., Vinay A., Politecnico di Milano, IT

In this paper is presented the mechanical characterization of thin polysilicon using different test structures. There are described two classes of on-chip test structures, with movement respectively in a plane parallel to the substrate and [...]