Engineered Nanostructures for High Thermal Conductivity Substrates
Varanasi K.K., Chamarthy P., Chauhan S., de Bock P., Kulkarni A., Mandrusiak G., Rush B., Russ B., Denault L., Weaver S., Gerner F., Leland Q., Yerkes K., Massachusetts Institute of Technology, US
In the DARPA Thermal Ground Plane (TGP) program, GE and its partners, the University of Cincinnati and the Air Force Research Laboratory, are developing a new thermal technology that will enable a monumental thermal technological [...]