Shing T-K – TechConnect Briefs

The Analysis of the Influence of the Auxiliary Components on FBAR Response

Shing T-K, Tai C.H., Lee Y.D., Tien C.C., ITRI, TW

In recent years we have witnessed the explosive growth of wireless communication services. The future trend of wireless products is towards integration, size and cost reduction. With MEMS technologies, the thin film bulk acoustic wave [...]

Analysis of Anodic Bonding and Packaging Effects in Micro Sensors

Shing T-K, Industrial Technology Research Institute, TW

Anodic bonding is quite popular in making micro-sensors since it can bond sodium-rich glass to silicon or virtually any metals with good adhesion strength in lower temperature. It is well known that this process will [...]

Robust Design of Silicon Piezoresistive Pressure Sensors

Shing T-K, Industrial Technology Research Institute, TW

In order to analyze silicon piezoresistive pressure sensors, several methods are used to obtain the stress distribution for different sizes and config,urations of square diaphragm type silicon pressure sensors. Furthermore, through integral considerations and thoughtful [...]