Ostergaard D.F. – TechConnect Briefs

Quality Based Design and Design for Reliability of Micro Electro Mechanical Systems (MEMS) Using Probabilistic Methods

Reh S., Lethbridge P., Ostergaard D.F., ANSYS, Inc., US

The paper demonstrates the use of probabilistic methods to assess the electromechanical behavior of micro electromechanical systems (MEMS) under the presence of micromachining manufacturing and process uncertainties. Probabilistic Methods are used to assess uncertainties involved [...]

Finite Element Based Reduced Order Modeling of Micro Electro Mechanical Systems (MEMS)

Ostergaard D.F., Gyimesi M., ANSYS, Inc., US

The paper demonstrates reduced order modeling (ROM) of the strongly coupled system level dynamic analysis of micro electro mechanical systems (MEMS) by lumped finite elements (FE) and substructuring implemented in the ANSYS/Multiphysics program.

Finite Element Based Electrostatic-Structural Coupled Analysis with Automated Mesh Morphing

Zhulin V.I., Owen S.J., Ostergaard D.F., ANSYS, Inc., US

A co-simulation tool based on finite element principles has been developed to solve coupled electrostatic-structural problems. An automated mesh morphing algorithm has been employed to update the field mesh after structural deformation. The co-simulation tool [...]

Hybrid P-Element and Trefftz Method for Capacitance Computation

Gyimesi M., Wang J-S., Ostergaard D.F., ANSYS, Inc., US

The paper discusses efficient electrostatic field solutions techniques to simulate micro electro mechanical systems (MEMS): adaptive p-elements to remove the burden of manual mesh refinement; hybrid finite elements - Trefftz formulation to treat open boundary [...]