Michel B. – TechConnect Briefs

Nanoscale deformation analysis for fracture mechanical evaluation of interface cracks in electronic packages

Keller J., Schulz M., Mrossko R., Wunderle B., Michel B., AMIC Angwandte Micro-Messtechnik GmbH, DE

The ongoing development of highly integrated electronic packages leads to a steadily increasing number of material interfaces within a package. In combination with increasing harshness (vibration, humidity, temperature) of the system environment the reliability of [...]

Fracture mechanical test methods for interface crack evaluation of electronic packages

Keller J., Maus I., Pape H., Wunderle B., Michel B., AMIC Angewandte Micro-Messtechnik GmbH, DE

The ongoing development of highly integrated electronic packages leads to a steadily increasing number of material interfaces within a package. In combination with increasing harshness (vibration, humidity, temperature) of the system environment the reliability of [...]

Reliability Analysis of Low Temperature Low Pressure Ag-Sinter Die Attach

Mrossko R., Oppermann H., Wunderle B., Winkler T., Michel B., Berliner Nanotest und Design GmbH, DE

The amount of heat which has to be dissipated from power electronics and microprocessors increases more and more due the ongoing miniaturization. Therefore new interface materials with high electrical and thermal conductivity have to be [...]

Three-dimensional Deformation Analysis of MEMS/NEMS by means of X-ray Computer-Tomography

Hammacher J., Dost M., Faust W., Scheiter L., Erb R., Michel B., Fraunhofer ENAS, DE

High resolution x-ray computertomography allows the non-destructive 3D-analysis of materials and compounds. Therefore, information of the internal structure of the material or the device becomes available, which are otherwise only gained by destructive analysis. But [...]

Joint Technology Initiative Clean Sky – The European Program Towards Ecologically Compatible Air Transportation

Kaulfersch E., Rzepka S., Michel B., Fraunhofer ENAS, DE

The paper aims to introduce ‘Clean Sky’, the largest European aeronautics research programme that will radically improve the impact of air transport on the environment while strengthening and securing aeronautics industry’s competitiveness. The results of [...]

Networking in Micro/Nano Reliability Research Encouraged by EUCEMAN, the European Center for Micro- and Nanoreliability

Michel B., Hammacher J., Winkler T., Kaulfersch E., Fraunhofer ENAS, DE

Based on the conviction that advanced micro and nanotechnologies are continuing to have an ever stronger influence in all spheres of human life and will permeate them even more fully in the future, without, conversely, [...]

Influence of moisture on humidity sensitive material parameters of microelectonic relevant polymers

Walter H., Dermitzaki E., Wunderle B., Michel B., Fraunhofer IZM, DE

This paper presents various modified measurement methods for analysis the effect of moisture of thermo-mechanical properties of MEMS relevant polymer systems. It was developed an advanced measurement method, modified DMA multifrequency and hygroscopic swell analysis, [...]

Advanced Virtual Qualification Methods to Reduce the Time-to-Market of Microelectronic Assemblies

Shirangi M.H., Koyuncu M., Keller J., Michel B., Bosch Mahle TS GmbH, DE

This work presents some recent progresses in reliability assessment of electronic assemblies in automotive industry and shows how coupled numerical-experimental techniques can help saving time and reducing the cost of IC package qualification. In order [...]

Adhesion of moulding compounds. Can material pre-selection increase the reliability of electronic components?

Pufall R., Michel B., Kaulfersch E., Infineon Technology AG, DE

It is well known that high temperature storage can degrade moulding compounds for chip encapsulation to such an extent that the adhesions to surfaces like copper (lead frames) or polyimide (chip coating) decreases drastically causing [...]

Nanoscale Resolution Deformation Measurements at Crack Tips of Nanostructured Materials and Interface Cracks

Keller J., Vogel D., Gollhardt A., Michel B., Fraunhofer Institute for Reliability and Microintegration, DE

The trend towards the application of nanoparticle filled materials in the aerospace and automotive electronics sectors have led to a strong need in material characterization on the micro and nano scale. In addition MEMS and [...]