Lee D.E. – TechConnect Briefs

Analysis of density variation for different temperatures in thermal nano imprinting process

Lee D.E., Lee H.J., Lee W.I., Lee D.E., Lee H.J., Lee W.I., Choi S-W, Lee D.E., Lee H.J., Lee W.I., Seoul National University, KR

Density variation of the polymer resist for different temperatures in thermal nano imprinting1 process was studied by both experiments and molecular dynamics (MD) simulations. After patterning, we estimated the local density by measuring the pull-off [...]

Numerical Simulation of NIL Process Based on Continuum hypothesis

Kim S.M., Woo Y.S., Lee D.E., Lee W.I., Lee D.E., Lee W.I., Seoul Nat'l Univ., KR

Nano imprint lithography(NIL) is a cost-efficient, high-throughput processing technique to transfer nano-scale patterns onto thin polymer films. Polymers used as the resist include UV cured resins as well as thermoplastics such as polymethyl-methacrylate(PMMA). In this [...]