Kulkarni A. – TechConnect Briefs

Silicon lens arrays for wafer level packaging of IR-sensors

Kulkarni A., Stenchly V., Quenzer J., Dudde R., Fraunhofer Institute Silicon Technology, DE

A new process technology has been developed for a cost efficient production of refractive convex lenses made of silicon. These lenses are produced as lens arrays on standard 8 inch silicon wafers to allow the [...]

Engineered Nanostructures for High Thermal Conductivity Substrates

Varanasi K.K., Chamarthy P., Chauhan S., de Bock P., Kulkarni A., Mandrusiak G., Rush B., Russ B., Denault L., Weaver S., Gerner F., Leland Q., Yerkes K., Massachusetts Institute of Technology, US

In the DARPA Thermal Ground Plane (TGP) program, GE and its partners, the University of Cincinnati and the Air Force Research Laboratory, are developing a new thermal technology that will enable a monumental thermal technological [...]

Multiscale Simulation of the Thermal Desorption of Large Molecules from Solid Surfaces

Fichthorn K., Miron R.A., Kulkarni A., Pennsylvania State University, US

We use molecular-dynamics simulations and importance sampling to obtain transition-state theory rate constants for thermal desorption of an n-alkane series from Pt(111). These simulations indicate that the binding of a large molecule to a solid [...]