Klein M. – TechConnect Briefs

Surface Nanostructuration: from coatings to MEMS fabrication

Pugin R., Blondiaux N., Popa A.M., Klein M., Montagne F., Scolan E., Hoogerwerf A., Overstolz T., Liley M., Giazzon M., Weder G., Heinzelmann H., Centre Suisse d’Electronique et de microtechnique, CH

The fabrication of surfaces and films with controlled nanometer features is currently an active area of research. The design of complex nanoarchitectures with novel physical properties has potential applications in many existing and emerging fields [...]

Biocompatible Hybrid System Integration of Silicon Based Neural Interface Device

Tathireddy P., Chakravarthy S., Hsu J., Klein M., Oppermann H., Rieth L., Harrison R., Normann R.A., Solzbacher F., University of Utah and Fraunhofer Institute, Germany, US

Chronically implantable wireless neural interfaces require biocompatible and stable high density integration of sensing, data processing, communication and power supply. The objective of this research was to develop a biocompatible wafer level integration technology for [...]

FEA Simulation of Thin Film Coils to Power Wireless Neural Interfaces

Kim S., Scholz O., Zoschke K., Harrison R., Solzbacher F., Klein M., Toepper M., Fraunhofer Institute for Biomedical Engineering, DE

To wirelessly transfer energy into active biomedical devices such as neural stimulators or bio-monitors implanted in the body, magnetic coupling of a pair of coils has been commonly used. The growing demand for highly miniaturized [...]