Kitamura T. – TechConnect Briefs

Ab Initio Simulation on Mechanical and Electronic Properties of Nanostructures under Deformation

Umeno Y., Kitamura T., Kyoto University, JP

Nanostructures have been attracting attention because of their prominent properties, and their applications for novel devices with advanced functions have been attemted. Large stress and strain occur in local regions in materials with nanostructures owing [...]

Ab Initio Simulation on Deposit Process of Al on Si Surface

Umeno Y., Kitamura T., Kyoto University, JP

It is important to clarify structure of contact between different materials for evaluation of properties of interfaces, which are substantial in electronic devices. Since interaction between different materials has to be evaluated based on the [...]

Ab Initio Simulation on Ideal Shear Strength of Silicon

Umeno Y., Kitamura T., Kyoto University, JP

Single crystal of silicon is commonly used for the substrate of electronic devices. Large stress is induced in the substrate due to thermal mismatch of device component. It is well known that a defect such [...]

Ab Initio Molecular Dynamics Simulation on Structure and Strength of Si/Al Interface

Umeno Y., Kitamura T., Kyoto University, JP

It is of great importance to clarify the atomic structure and strength of interfaces between metal and Si substrate in an electronic device. While interaction between atoms near the interface is complicated, ab initio molecular [...]