Micro to Nano – Scaling Packaging Technologies for Future Microsystems
Braun T., Becker K.-F., Bauer J., Hausel F., Pahl B., Wittler O., Mrossko R., Jung E., Ostmann A., Koch M., Bader V., Minge C., Aschenbrenner R., Reichl H., Technical University Berlin, DE
As the development of microelectronics is still driving towards further miniaturization new materials, processes and technologies are crucial for the realization of future cost effective microsystems and components. These future systems will not only consist [...]