Development of a Scalelable Interconnection Technology for Nano Packaging
Becker K.-F., Löher T., Pahl B., Wittler O., Jordan R., Bauer J., Aschenbrenner R., Reichl H., Fraunhofer IZM, DE
Microelectronics miniaturization is following Moore’s law since the mid sixties and over the years it has always been possible to follow it without meeting fundamental technological limits. This might be in question for future applications, [...]