Three-Dimensional Transient Electro-Thermal Interconnect Simulation for Stress and Electromigration Analysis
Holzer S., Hollauer Ch., Ceric H., Wagner S., Entner R., Langer E., Grasser T., Selberherr S., Vienna University of Technology, AT
We introduce the combination of three-dimensional transient electro-thermal interconnect simulations for intrinsic thermo-mechanical stress problems. In order to study the development of thermal stresses we use a finite element simulator for the investigation on stresses [...]