Hoffmann M. – TechConnect Briefs

Non-contact biaxial nanoprobe utilized for surface measurements of MEMS

Goj B., Dressler L., Hoffmann M., Ilmenau University of Technology, DE

In this work an oscillating biaxial nanoprobe will be presented which measures the surface of a measurement object. The biaxial nanoprobe vibrates in two directions to realize scanning measurements and to overcome the challenges of [...]

Silicon on ceramics – a new concept for micro-nano-integration on wafer level

Fischer M., Bartsch de Torres H., Pawlowski B., Mach M., Gade R., Barth S., Hoffmann M., Müller J., Technische Universitat Ilmenau, DE

A new integration concept for silicon devices to ceramic substrates based on a new bonding technique between nano-scaled, modified Black Silicon and an adapted, unfired LTCC substrate is presented. The novel technique enables to combine [...]