Heino P. – TechConnect Briefs

Strength of Nanoscale Copper Connection Under Shear

Heino P., Tampere University of Technology, FI

Strength and shear modulus of several polycrystalline copper systems were calculated with the molecular dynamics method and effective-medium potential. Grain size varied between 2{10nm and systems were sheared beyond the yield point at room temperature. [...]

Molecular Dynamics Study of Thermally Induced Shear Strain in Nanoscale Copper

Heino P., Ristolainen E., Tampere University of Technology, FI

We study the effects of thermally induced shear strain and stress in several nanoscale copper systems consisting of about 200k atoms with the effective-medium theory and molecular dynamics method. Both edge and screw dislocations are [...]