Demmel J. – TechConnect Briefs

MEMS Process Characterization with an on-Chip Device

Garmire D., Choo H., Muller R.S., Govindjee S., Demmel J., UC-Berkeley, US

We have developed a CMOS-compatible, compact device and a simple procedure for measuring three important fabrication characteristics of planar-processed microelectromechanical (MEMS) structures: in-plane over- or under-cut, Young’s Modulus, and comb-drive forces in a MEMS process. [...]

Practical Techniques for Measuring MEMS Properties

Clark J.V., Garmire D., Last M., Demmel J., Govindjee S., Berkeley Sensor and Actuator Center, US

We describe simple test structures and practical analysis techniques to measure properties of MEMS devices. Our structures are designed to test many quantities using simple electric probes in a minimal chip area. We analyze differences [...]

New Numerical Techniques and Tools in SUGAR for 3D MEMS Simulation

Bai Z., Bindel D., Clark J., Demmel J., Pister K., Zhou N., University of California Davis, US

SUGAR is a modified nodal analysis package for 3D MEMS simulations that owes its heritage and its name to the SPICE family of circuit simulation. SUGAR has undergone the stage of proof-of-concept which showed that [...]